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Intel® Atom™ Processor E6xx Series: Thermal Guide

Intel® Atom™ Processor E6xx Series: Thermal Guide

Introduction

This document describes thermal and mechanical design guidelines for the Intel® Atom™ processor E6xx series in the micro Flip Chip Ball Grid Array package.

In the embedded market, electronic components, system motherboard form factor, and chassis design space are becoming smaller and more complex. To ensure that quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Heat can be dissipated through the use of forced, free, or mixed airflow, and/or the use of heatsinks.

The goals of this document are to:
• Specify the thermal and mechanical specifications for the device
• Describe a reference thermal solution that meets the specifications

A properly designed thermal solution will adequately cool the device at or below the thermal specification. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The information provided in this document is for reference only and additional validation must be performed prior to implementing the designs into final production. The intent of this document is to assist each original equipment manufacturer (OEM) with the development of thermal solutions for their individual designs. The final heatsink solution, including the heatsink, attachment method, and thermal interface material, must comply with the mechanical design, environmental, and reliability requirements delineated in the Intel® Atom™ Processor E6xx Series Datasheet. It is the responsibility of OEMs to validate the thermal solution design with their specific applications.

This document addresses thermal and mechanical design specifications for the processor only. For thermal design information on other Intel® components, please refer to the component’s datasheet.

Read the full Intel® Atom™ Processor E6xx Series Thermal Guide.

Intel® Atom™ Processor E6xx Series: Thermal Guide

Introduction

This document describes thermal and mechanical design guidelines for the Intel® Atom™ processor E6xx series in the micro Flip Chip Ball Grid Array package.

In the embedded market, electronic components, system motherboard form factor, and chassis design space are becoming smaller and more complex. To ensure that quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Heat can be dissipated through the use of forced, free, or mixed airflow, and/or the use of heatsinks.

The goals of this document are to:
• Specify the thermal and mechanical specifications for the device
• Describe a reference thermal solution that meets the specifications

A properly designed thermal solution will adequately cool the device at or below the thermal specification. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The information provided in this document is for reference only and additional validation must be performed prior to implementing the designs into final production. The intent of this document is to assist each original equipment manufacturer (OEM) with the development of thermal solutions for their individual designs. The final heatsink solution, including the heatsink, attachment method, and thermal interface material, must comply with the mechanical design, environmental, and reliability requirements delineated in the Intel® Atom™ Processor E6xx Series Datasheet. It is the responsibility of OEMs to validate the thermal solution design with their specific applications.

This document addresses thermal and mechanical design specifications for the processor only. For thermal design information on other Intel® components, please refer to the component’s datasheet.

Read the full Intel® Atom™ Processor E6xx Series Thermal Guide.

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