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Intel® Xeon® Processor E5-2600 v3 General Energy Efficiency

Benchmarks: Compares the general computing energy efficiency performance with SPECpower_ssj*2008 of the Intel® Xeon® processor E5-2600 v3.

Intel® Xeon® Processor E5-2600 v3 General Integer Throughput

Benchmarks: Compares the integer throughput general computing performance with SPEC CPU*2006 of the Intel® Xeon® processor E5-2600 v3.

Manuais do Desenvolvedor de Software das Arquiteturas Intel® 64 e IA-32

Manuais do desenvolvedor de software para download e informações sobre pedidos de CD-ROM para as arquiteturas Intel® 64 e IA-32

Integrated Network Acceleration of Intel and Microsoft

White paper discusses integrated network acceleration benefits of Intel® I/O Acceleration Technology and Microsoft Windows Server 2008*.

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Virtualization Technology on Intel® Atom™ Platform

Video: real-time OS demo working on Intel® Atom™ processor based systems with Intel® Virtualization technology at Embedded World 2010.

Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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Intel's Packaging Databook Chapter 9: SMT Board Assembly Process Recs

Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.

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