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Remote Graphics Performance: Intel® Xeon® Processor E3-1200 v4

Shows configuration details for 3DMark* 11 performance with the Intel® Xeon® processor E3-1200 v4 product family.

Guia do parceiro em HPC para o Data Center

Guia do parceiro em HPC para o Data Center.

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Família do Centro de dados de SSDs Intel®

Otimize o desempenho, reduza o uso de energia e baixe os custos operacionais com a Família do centro de dados de SSD Intel®, projetada para cargas de trabalho de armazenamento intensivo.

Taking Oil and Gas Exploration to the Next Level

Case Study: DownUnder GeoSolutions speeds up oil and gas exploration with an Intel® Xeon® processor E5-2600 v2 product family-based HPC platform.

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Wearable Medical Devices, Big Data & Parkinson’s Disease Research

Learn how wearable medical devices are advancing Parkinson’s research through the collection and analysis of data that has never been seen before.

Non-Volatile Memory

3D XPoint™ is a new breakthrough in non-volatile memory technology enabling memory-like performance at storage-like capacity and cost.

Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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Intel's Packaging Databook Chapter 9: SMT Board Assembly Process Recs

Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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